Job Details:

Job Description:

Responsibilities:

• Responsible for Test hardware (Loadboard, Probe card, Test Socket, Probe Head, Contact pins) specification definition, development, debug, validation and qualification for Sort, and Final Testing (Package) of PSG FPGA products.

• Responsible to enable test capability to meet diverse and critical test requirements e.g. High Speed testing, Loop Back testing, and High Current testing.

• Responsible to develop cost effective and robust test hardware solution that ease the maintenance, and scalable to meet production demand.

• Responsible to gather hardware technical requirements from stakeholder, conceptualization and implementation on actual test hardware.

• Responsible to identify and implement value engineering activities to improve the test stability and robustness as part of continuous improvement process.

• Participate in tester configuration definition, proliferation, and standardization across Intel PSG products.

• Provide technical leadership and tactical support in resolving test hardware issue during first article and engineering evaluation.

• To lead and drive the development of diagnostic tools and software to assist in test hardware debug and troubleshooting.

• Collaborate with worldwide cross-functional teams including designers, software, manufacturing, and product engineering, as to drive cost effective, robust and sustainable test hardware solution.

• Participate in test hardware benchmark initiative to optimize and innovate hardware development process and methodology.

                                                                                          

Requirements:

• Candidate must possess at least a BS/MS in Electrical Engineering or equivalent, with 5-8 years of industry experience in IC Design, IC Test, or IC Test Hardware development or equivalent field.

• Sound knowledge in test hardware debugging, troubleshooting, and methodical problem solving techniques.

• Experience in test hardware development for IC testing – wafer or package level.

• Experience in Schematic review, PCB layout review, and Manufacturing file (e.g. gerbers) review.

• Good knowledge on IC packaging, POD (Package outline dimension), and Pin out / map.

• Solid understanding of digital, analog and mixed signal circuits and its fundamental operation.

• Excellent analytical, project management, communication and interpersonal skills.

• Programming Language experience (C, C++, VB, Perl) is added advantage

• Knowledge of ATE, tester instrument and main component functionality is added advantage.

Qualifications:

Job Type:

Regular

Shift:

Shift 1 (Malaysia)

Primary Location:

Penang 15, Penang, Malaysia

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.