Job DescriptionWe are seeking an experienced Supplier Quality Engineer with deep, hands‑on expertise in IC assembly and test at OSATs. This role is critical to ensuring our products consistently meet the highest standards of quality and reliability, directly contributing to exceptional customer satisfaction. The ideal candidate brings strong technical mastery of semiconductor backend processes, a proven track record of partnering closely with OSAT engineering teams, and a passion for driving proactive, data‑driven continuous improvement across a global manufacturing supply base.Key Responsibilities:Strategic Supplier Quality Leadership
Serve as the primary technical and quality interface to OSAT partners, driving alignment on quality expectations, manufacturing capability, and long‑term improvement roadmaps.
Lead the development and execution of supplier quality strategies that strengthen backend manufacturing performance and reduce risk across the supply chain.
Influence supplier leadership and internal stakeholders to prioritize quality, reliability, and continuous improvement initiatives.
Advanced Assembly & Test Process Oversight
Provide deep technical oversight of OSAT assembly and test processes, including die attach, wire bond, flip‑chip, molding, underfill, singulation, and final test.
Evaluate supplier process capability, equipment readiness, and control methodologies to ensure robust, scalable manufacturing for both mature and advanced packaging technologies.
Guide suppliers in implementing best‑in‑class process controls, statistical methods, and reliability practices.
High‑Impact Issue Resolution & Prevention
Lead complex, cross‑functional problem‑solving efforts for systemic supplier issues, excursions, and customer‑impacting defects.
Drive rigorous root cause analysis and ensure durable corrective and preventive actions are implemented and verified.
Anticipate potential failure modes and proactively implement risk‑mitigation strategies across the supply base.
Supplier Development & Auditing
Conduct in‑depth technical audits focused on assembly/test capability, reliability performance, quality systems, and process maturity.
Develop and execute supplier improvement plans that elevate process capability, yield, and reliability performance.
Mentor suppliers on quality methodologies, reliability expectations, and advanced packaging requirements.
Continuous Improvement & Innovation
Drive initiatives that elevate supplier capability and reduce variability.
Identify and implement innovative approaches to improve backend quality, reliability, and operational efficiency.
Qualifications
Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or a related technical field.
Minimum 8 years of experience in semiconductor manufacturing, supplier quality, assembly engineering, packaging engineering, or OSAT management.
Deep technical knowledge of backend assembly and test processes, including die attach, wire bond, flip‑chip, molding, underfill, singulation, and final test.
Strong understanding of packaging materials (substrates, leadframes, molding compounds, solder balls, adhesives) and their impact on reliability and yield.
Proven experience directly interfacing with OSAT engineering teams and driving supplier‑level corrective actions, process improvements, and capability upgrades.
Demonstrated expertise in quality and reliability methodologies: SPC, DOE, FMEA, MSA, 8D, PFMEA, APQP, PPAP.
Strong analytical skills with the ability to interpret yield data, SPC charts, FA reports, and reliability results to drive decisions.
Excellent communication, negotiation, and leadership skills, with the ability to influence both internal teams and supplier leadership.
