Manufacturing Test Product Engineer (Final Test)

The Manufacturing Test–Product Engineer (Final Test) Provides manufacturing test engineering support for Final Test operations to ensure product quality, manufacturing readiness, and cost‑effective high‑volume production.  Collaborates with BU Product Engineers, Assembly Process Engineers, Quality Engg and Manufacturing operations in all aspects of Final Test Product and Test engineering areas for assigned products, including support of new product Safe Launch, technology ramps, and quality improvement initiatives to meet business, quality, and operational objectives.

•Provide technical ownership of Final Test manufacturing processes from product qualification through high‑volume production on assigned products or packages. •Support new product transfers, technology ramps, platform migrations of released solutions, process qualifications throughout manufacturing requiring Final Test characterization. •Manage, execute and sustain quality containment and firewall programs (FT SPAT/DPAT, ZT/ZD, Non‑Stop Manufacturing). •Define, implement, and sustain Final Test process flows, limits, guardbands, and control plans. •Lead FT yield improvement, defect reduction, and root‑cause analysis for production issues and excursions. •Drive quality and cost improvement initiatives with cross‑functional teams. •Provide timely technical support to manufacturing operations. •Develop and maintain technical documentation and best practices. •Owns FT hold lots analysis, disposition and improvement.  •Owns test program buyoff to ensure TP changes are vetted and validated to conform to required quality requirements for a robust TP program for manufacturing. •Education oBachelor’s degree or higher in Electrical Engineering, Electronics Engineering, Computer Engineering, Manufacturing Engineering, or Applied Physics  •Experience o3–8+ years of semiconductor manufacturing, test, or product engineering experience preferred. Strong candidates with good foundation in electronics, programming and problem solving are welcome to apply. Skills and Knowledge Requirement oTechnical Expertise & Consulting: •Strong understanding of semiconductor Final Test manufacturing fundamentals, common semiconductor device operation and characteristics.  •Knowledge of test coverage, guard banding, limits optimization, and characterization concepts •Experience with failure analysis processes and yield data interpretation •Familiarity with SPC, control plans, and quality systems in a manufacturing environment. •Moderate programming/scripting skills to modify test programs and flows, debug test failures and false rejects, develop analysis scripts and automation tools.  Collaborate with TD or BU for deeper code changes. oProblem Analysis:  •Proficiency in structured problem-solving methodologies (e.g., 8D, DMAIC, root cause analysis) •Ability to analyze large datasets and translate findings into actionable improvements •Strong troubleshooting skills in fast paced manufacturing environments oDecision Making: 

Makes decision or provides recommendation related to specific tasks. Major or unusual issues require referral to a supervisor, manager or higher-level technical staff.

oPlanning: 

Requires planning for effective execution of multiple, simultaneous tasks which require the scheduling of independent activities, resources or time schedules.

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here:

https://www.onsemi.com/careers/career-benefits